| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in fluidity, a semiconductor device using the epoxy resin composition, an organically modified inorganic filler, and a method of producing an epoxy resin composition.SOLUTION: The epoxy resin composition containing an epoxy resin (A) contains an organically modified inorganic filler (C) obtained by chemically bonding an organic modifier having a functional group selected from a carboxyl group, an amino group, and a hydroxyl group to an inorganic filler via the functional group. |
