发明名称 |
WIRE BOND INTEGRATED CIRCUIT PACKAGE FOR HIGH SPEED I/O |
摘要 |
An integrated circuit package includes a package substrate, a die attach pad formed on the package substrate for securing a die to the package substrate, a ground bonding ring formed on the package substrate for attaching core and I/O ground bond wires between the die and the package substrate, and a first plurality of bond fingers formed immediately adjacent to the ground bonding ring for attaching a first set of I/O signal bond wires between the package substrate and the die. |
申请公布号 |
EP2130221(A4) |
申请公布日期 |
2016.04.20 |
申请号 |
EP20070852471 |
申请日期 |
2007.09.27 |
申请人 |
LSI CORPORATION |
发明人 |
FISHLEY, CLIFFORD;AWUJOOLA, ABIOLA;MORA, LEONARD;AMIN, AMAR;OTHIENO, MAURICE;CHIA, CHOK J. |
分类号 |
H01L23/28;H01L23/00;H01L23/498;H01L23/50;H01L23/66 |
主分类号 |
H01L23/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|