METHOD AND APPARATUS FOR PREALIGNER TRANSPARENT WAFER USING IMAGE PICKUP DEVICE

摘要

The present invention relates to a method and an apparatus for aligning a transparent wafer using an image pickup device which is suitable for aligning a transparent wafer. The apparatus for aligning a transparent wafer using an image pickup device comprises: a light generation unit (100) to generate light; a wafer position drive unit (200) to load, align, and transport a wafer (10); a light source sensor (300) which faces the light generation unit (100), disposes the wafer (10) between the light generation unit (100) and the same, and receives the light of the light generation unit (100); an image analysis unit (400) to analyze an image received by the light source sensor (300); a control unit (500) to approximate a function for image data analyzed by the image analysis unit (400) by a least mean square (LMS) method using a second-order polynomial function to search for a vertex of a parabola, and approximate a function by an LMS method using an equation of a circle to obtain a center position of the wafer; and a wafer position adjustment unit (700) to adjust the wafer position drive unit (200) according to control of the control unit (500) to adjust the center position of the transported and loaded wafer (10) to align the wafer (10).