| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for a flexible device improved in yield by suppressing a decline in electrical properties caused by disconnection or the like even if a film thickness is made extremely thin. <P>SOLUTION: The substrate 1 for the flexible device includes a base material 2, and a flattened layer 3 formed on the base material 2 and containing polyimide. The surface roughness Ra of a measurement region 10 μm square on the surface of the flattened layer 3 is 5 nm or less, and the surface roughness Ra of a measurement region 1 μm square on the surface of the flattened layer 3 is 5 nm or less. The number average molecular weight of polyimide is 2,000-1,000,000. <P>COPYRIGHT: (C)2013,JPO&INPIT |
