发明名称 半導体インプリント用テンプレート
摘要 <P>PROBLEM TO BE SOLVED: To provide a template that does not require a complicated suction mechanism for an imprint device by preventing resist from oozing out to an adjacent field and making a gap between shots. <P>SOLUTION: There is provided a template for semiconductor imprint such that a template having an uneven pattern formed is pressed against a photocuring material and the uneven pattern is transferred by optically curing the photocuring material, and the template is provided with an auxiliary pattern which assists the photocuring material in making a wet spread uniformly along a field edge of the template by capillarity, and absorbs an excessive photocuring material, the auxiliary pattern being a line pattern comprising a plurality of segmented recessed parts provided at a periphery of the field edge in parallel with the field edge. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5906598(B2) 申请公布日期 2016.04.20
申请号 JP20110169829 申请日期 2011.08.03
申请人 大日本印刷株式会社 发明人 市村 公二
分类号 H01L21/027;B29C59/02 主分类号 H01L21/027
代理机构 代理人
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