Pulse plating methods which include a forward pulse but no reverse pulse inhibit or reduce dimpling and voids during copper electroplating of through-holes in substrates such as printed circuit boards. The pulse plating methods may be used to fill through-holes with copper where the through-holes are coated with electroless copper or flash copper.
申请公布号
EP3009533(A1)
申请公布日期
2016.04.20
申请号
EP20150189090
申请日期
2015.10.09
申请人
ROHM AND HAAS ELECTRONIC MATERIALS LLC
发明人
JAYARAJU, NAGARAJAN;BARSTAD, LEON R.;NAJJAR, ELIE H.