Semiconductor light emitting device and method for manufacturing the same

摘要

A semiconductor light emitting device includes a first semiconductor layer of a first conductivity type, a first electrode layer, a light emitting layer, a second semiconductor layer, a third semiconductor layer and a second electrode layer. The first electrode layer includes a metal portion having a plurality of opening portions. The opening portions penetrate the metal portion and have an equivalent circle diameter of a shape of the opening portions. The light emitting layer is between the first semiconductor layer and the first electrode layer. The second semiconductor layer of a second conductivity type is between the light emitting layer and the first electrode layer. The third semiconductor layer of a second conductivity type is between the second semiconductor layer and the first electrode layer. The second electrode layer is connected to the first semiconductor layer.

主权项

1. A semiconductor light emitting device comprising:
a first semiconductor layer of a first conductivity type; a first electrode layer including a metal portion having a plurality of opening portions, the metal portion having a thickness of not less than 10 nanometers and not more than 50 nanometers along a direction from the first semiconductor layer toward the first electrode layer, the plurality of opening portions penetrating the metal portion along the direction, each of the opening portions having an equivalent circle diameter of each shape of the opening portions when viewed along the direction, the equivalent circle diameter being not less than 10 nanometers and not more than 5 micrometers; alight emitting layer provided between the first semiconductor layer and first electrode layer; a second semiconductor layer of a second conductivity type provided between the light emitting layer and the first electrode layer; a third semiconductor layer of the second conductivity type provided between the second semiconductor layer and the first electrode layer; and a second electrode layer connected to the first semiconductor layer, the equivalent circle diameter of each respective of the opening portions being equal to 2×(Area/π)1/2, the Area being an area of the respective opening portion, wherein an interface between the first electrode layer and the third semiconductor layer includes a dopant, and wherein the first electrode layer is made of at least one metal or an alloy selected from the group consisting of Au, Ag, Al, Zn, Zr, Pt, Rh, Ni, Pd, Cu, Sn, C, Mg, Cr, Te, Se and Ti.