Electrical interconnect IC device socket

摘要

A surface mount electrical interconnect is disclosed that provides an interface between a PCB and solder balls of a BGA device. The electrical interconnect includes a socket substrate and a plurality of electrically conductive contact members. The socket substrate has a first layer with a plurality of openings configured to receive solder balls of the BGA device and has a second layer with a plurality of slots defined therethrough that correspond to the plurality of openings. The contact members may be disposed in the openings in the first layer and through the plurality of slots of the second layer of the socket substrate. The contact members can be configured to engage a top portion, a center diameter, and a lower portion of the solder ball of the BGA device. Each contact member electrically couples a solder ball on the BGA device to the PCB.

主权项

1. A surface mount electrical interconnect to provide an interface between a PCB and solder balls on a BGA device, the electrical interconnect comprising: a socket substrate comprising a first layer having a plurality of openings configured to receive the solder balls on the BGA device and a second layer having a plurality of slots defined therethrough that correspond to the plurality of openings; and a plurality of electrically conductive contact members disposed in the openings in the first layer and through the plurality of slots of the second layer of the socket substrate, each contact member configured to electrically couple a solder ball on the BGA device to the PCB, wherein each contact member comprises at least three interlocking contact plates that engage with each other in a single opening in the socket substrate and including a semicircular defining a notch with a diameter corresponding to a diameter of the solder balls that simultaneously engages at least a center diameter and a lower portion of the solder balls at a solder ball interface region, the notch configured to be positioned in the opening of the first layer and configured to receive a portion of the solder ball such that a solder ball positioned in the opening is nested within the notch in contact with the contact plate.