High efficiency light emitting diode package suitable for wafer level packaging

摘要

An LED package and method for LED packaging is disclosed. In one embodiment, an LED package includes a carrier substrate having a predefined surface area, an LED device bonded to the carrier substrate, the LED device having a footprint area of at least fifty percent of the predefined surface area of the carrier substrate, and an encapsulant lens having a top surface inclined inwardly at an angle in the range of about 10° to about 140°. In one embodiment, the top surface of the encapsulant lens layer has a concave cone shape. In one embodiment, a wafer level packaging process includes forming an encapsulant lens layer portion having a top surface inclined inwardly at an angle in the range of about 10° to about 140° on each of a plurality of LED devices bonded to a carrier substrate wafer.

主权项

1. A light emitting diode (LED) package comprising:
a carrier substrate having a predefined surface area; an LED device bonded to the carrier substrate, the LED device having a top surface, a footprint area of at least fifty percent of the predefined surface area of the carrier substrate, and a sidewall having a set back distance from a sidewall of the carrier substrate, wherein the set back distance is between one quarter of one percent and fifteen percent of a width of the carrier substrate; and an encapsulant lens formed over the LED device, the encapsulant lens having a top surface inclined inwardly toward the top surface of the LED device and having a thickness at an interior portion of at least ten percent of a thickness at a peripheral portion relative to the top surface of the LED device.