Image sensor device and method

摘要

A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.

主权项

1. A method of manufacturing a semiconductor device, the method comprising:
forming a pixel within an image sensor; bonding the image sensor to a semiconductor device, the semiconductor device comprising a substrate and a heat sink at least partially located in a first metallization layer between the pixel and the substrate; and forming a thermal via extending through the image sensor and in thermal connection with the heat sink.