| 摘要 |
The present invention relates to an ingot cutting apparatus reducing thermal expansion of a wire guide, on which a wire is wound, thereby improving the quality of cutting of the ingot. The ingot cutting apparatus comprises: a work plate fixing an ingot to a lower side thereof and elevated in a vertical direction; at least two drive shafts installed on a lower side of the work plate at predetermined intervals to be driven to be rotated; a plurality of wire guides having a cylindrical shape to be installed to surround the driving shafts and having a plurality of grooves formed on the outer circumferences thereof at predetermined intervals; and a plurality of wires wound on the wire guides in such a manner that the wires are introduced into one side of each wire guide and are simultaneously drawn from the other side of each wire guide. The wire guides are installed on the drive shafts at predetermined intervals in an axial direction. |
