APPARATUS FOR CHEMICAL-MECHANICAL POLISHING OF WAFER

摘要

The present invention relates to a chemical mechanical polishing apparatus having a slurry supply unit supplying slurry. The slurry supply unit includes: a slurry guiding flow channel; an outflow port of the slurry guiding flow channel; a guiding flow channel block; a spray assisting gas pipe; a slurry washing water pipe; a slurry washing water spraying member; an assisting gas spraying member; and a slurry spraying member. According to the present invention, the chemical mechanical polishing apparatus can supply the slurry to an upper side of a polishing pad by a spray method while stably maintaining an opening state of a slurry spraying aperture.