| 主权项 |
1. An electronic circuit module component comprising:
an electronic component comprising an element body; and a board joined to the electronic component with solder, the element body comprising:
a first end surface and a second end face at two opposite ends, respectively, in a direction of the electronic component, the direction being parallel with the board;a mounting surface that opposes the board and connects the first end face and the second end face;an top surface that is on an opposite side of the mounting surface and connects the first end face and the second end face; anda first lateral face and a second lateral face substantially parallel with each other and each connecting the mounting surface, the top surface, the first end face and the second end face, and the electronic component comprising:
a first terminal electrode having a first end part formed on the first end face, a first part formed on a portion of the first lateral face and a portion of the second lateral face that are adjacent to the first end face, and a first mounting part formed on a portion of the mounting surface that is adjacent to the first end face,a second terminal electrode having a second end part formed on the second end face, a second side part formed on a portion of the first lateral face and a portion of the second lateral face that are adjacent to the second end face, second end face, and a second mounting part formed on a portion of the mounting surface that is adjacent to the second end face; andan oxide film covering the entire surface of the first end part and the entire surface of the first side part, the oxide film being obtained by oxidizing surfaces of the first and second terminal electrodes; wherein the first mounting part and the second mounting part are joined to the board with the solder. |
