| 发明名称 | Fiber reinforced resin molding compound and manufacturing method for fiber reinforced resin molded article therefrom | ||
| 摘要 | A molding compound for manufacturing a fiber reinforced molded article is provided. The molding compound includes a resin composition and reinforcing fibers, with the resin composition containing an unsaturated polyester resin, a microencapsulated curing agent and a non-microencapsulated curing agent. | ||
| 申请公布号 | US9315655(B2) | 申请公布日期 | 2016.04.19 |
| 申请号 | US201214363332 | 申请日期 | 2012.12.06 |
| 申请人 | OCV Intellectual Capital, LLC | 发明人 | Akagawa Mitsuru |
| 分类号 | C08K7/14;C08K9/10;C08K7/02;C08J3/24;C08J5/04;C08K7/06;C08K5/00;C08K5/14 | 主分类号 | C08K7/14 |
| 代理机构 | Calfee, Halter & Griswold LLP | 代理人 | Calfee, Halter & Griswold LLP |
| 主权项 | 1. A molding compound comprising a resin composition and reinforcing fibers, wherein the resin composition contains an unsaturated polyester resin, a microencapsulated curing agent and a non-microencapsulated curing agent, wherein the non-microencapsulated curing agent has a longer curing time compared with the microencapsulated curing agent, wherein the microencapsulated curing agent contains an organic peroxide having a one minute half-life temperature of 115° C. to 130° C.; and wherein the non-microencapsulated curing agent contains an organic peroxide having a one minute half-life temperature of 140° C. to 170° C. | ||
| 地址 | Toledo OH US | ||