Detecting thermal interface material (‘TIM’) between a heat sink and an integrated circuit

摘要

Detecting TIM between a heat sink and an integrated circuit, the integrated circuit including TIM detection points adapted to receive TIM upon installation of the heat sink and including a TIM detection device configured to be activated upon contact with TIM, including: receiving, upon installation of the heat sink on the integrated circuit and the TIM, TIM in one or more of the TIM detection points; activating, by the TIM in each of the one or more TIM detection points receiving the TIM, a TIM detection device; determining, by a TIM detection module of the integrated circuit in dependence upon the activations of the TIM detection devices, sufficiency of the TIM; and responsive to determining that the TIM between the heat sink and the integrated circuit is insufficient, controlling, in real-time by the TIM detection module, operation of the integrated circuit to reduce heat generated by the integrated circuit.

主权项

1. A method of detecting thermal interface material (TIM) between a heat sink and an integrated circuit that comprises a plurality of TIM detection points, the method comprising:
receiving, upon installation of the heat sink on the integrated circuit and the TIM in one or more of the TIM detection points, wherein each of the one or more TIM detection points includes a TIM detection device; activating, in each of the one or more TIM detection points receiving the TIM, a TIM detection device; determining, in dependence upon the activations of the TIM detection devices, sufficiency of the TIM between the heat sink and the integrated circuit; and responsive to determining that the TIM between the heat sink and the integrated circuit is insufficient, controlling, in real-time, operation of the integrated circuit to reduce heat generated by the integrated circuit.