| 发明名称 | Photocurable adhesive composition | ||
| 摘要 | Provided is an adhesive composition comprising: a thermosetting epoxy resin formed with an epoxy copolymer containing a hydroxyl group; and a UV curable epoxy resin having an epoxy equivalence of 100 g/eq to 500 g/eq. | ||
| 申请公布号 | US9315699(B2) | 申请公布日期 | 2016.04.19 |
| 申请号 | US201314424715 | 申请日期 | 2013.09.04 |
| 申请人 | LG HAUSYS, LTD. | 发明人 | Kim Sang Hwan;Lee Yong Hoon;Kim Dai Hyun;Choi Won Gu;Kim Jang Soon |
| 分类号 | C08F2/46;C08F2/50;C08G61/04;C09J163/00;C09J163/04 | 主分类号 | C08F2/46 |
| 代理机构 | Hauptman Ham, LLP | 代理人 | Hauptman Ham, LLP |
| 主权项 | 1. An adhesive composition comprising: a thermally curable epoxy resin formed of a hydroxyl group-containing epoxy copolymer; and a UV curable epoxy resin having an epoxy equivalent weight of 100 g/eq to 500 g/eq, wherein the epoxy copolymer has a weight average molecular weight of 20,000 to 70,000; and the thermally curable epoxy resin has a hydroxyl group equivalent weight of 200 g/eq to 400 g/eq. | ||
| 地址 | Seoul KR | ||