Multi-stage debulk and compaction of thick composite repair laminates

摘要

A method for fabricating a repair laminate for a composite part having an exposed surface includes applying a release film to the exposed surface and forming an uncured ply stack assembly on the release film. The uncured ply stack assembly is formed by forming and compacting a series of uncured ply stacks. The release film and ply stack assembly is then removed from the exposed surface. A bonding material is then applied to the exposed surface, and the uncured ply stack assembly is applied to the bonding material. The ply stack assembly and bonding material are then cured.

主权项

1. A method for fabricating a repair laminate for a composite part having an exposed surface, comprising:
applying a release film to the exposed surface, the release film being in direct contact with the exposed surface; applying a first ply stack to the release film, the first ply stack having a first plurality of uncured plies, the first ply stack being in direct contact with the release film; compacting the first plurality of uncured plies; applying a second ply stack to the first ply stack, the second ply stack having a second plurality of uncured plies; compacting the second plurality of uncured plies; removing the release film from underneath the first ply stack and the second ply stack from the exposed surface; removing the first and second ply stacks from the composite part; applying bonding material to the exposed surface; forming an uncured ply stack assembly from the first ply stack and the second ply stack; bonding the uncured ply stack assembly to the exposed surface with the bonding material; and curing the ply stack assembly and the bonding material; wherein the first ply stack is compacted prior to the second ply stack being applied and subsequently compacted; wherein the first ply stack is located between the exposed surface and a heat source and the heat source is operated to apply heat to the first ply stack during compacting of the first ply stack; and wherein the temperature during compacting is below a curing temperature.