发明名称 Thermal interface material
摘要 There is provided a thermal interface material, TIM, a thermal interface application comprising such a TIM, and corresponding methods for providing the material and the thermal interface. The TIM comprises a TIM layer in which an activable shrinkage material is distributed, such that upon activation of the shrinkage material the thickness of the TIM layer is increased. In the thermal interface application, where the TIM (400) is arranged between a heat generating component (20) and a heat conducting element (30), the increase in thickness of the TIM layer is utilized to increase the contact pressure on mating surfaces. The TIM is sandwiched between the heat generating component and the heat conducting element before the activation of the shrinkage material, and the distance (h) between the heat generating component and the heat conducting element is restricted such upon activation of the shrinkage material, the restricted maximum height (h) between the heat generating component and the heat conducting element in combination with the TIM increasing the thickness of the TIM layer, the contact pressure on the mating surfaces is increased.
申请公布号 US9316447(B2) 申请公布日期 2016.04.19
申请号 US201314386191 申请日期 2013.03.11
申请人 KONINKLIJKE PHILIPS N.V. 发明人 Fleskens Bas;Den Boer Reinier Imre Anton
分类号 H01L23/42;F28F3/00;H01L23/373;B29C55/12;F21V29/00;F28F21/00;B29K101/12;B29K105/00;B29L9/00;F21Y101/02 主分类号 H01L23/42
代理机构 代理人
主权项 1. A thermal interface material, TIM comprising: a TIM layer comprising an activable shrinkage material that shrinks upon activation of the shrinkage material; wherein said shrinkage material is distributed in said TIM layer such that upon activation of said shrinkage material the thickness of said TIM layer is increased.
地址 Eindhoven NL