| 发明名称 | Method of recovering a bonding apparatus from a bonding failure | ||
| 摘要 | A method of recovering a bonding apparatus from a bonding failure to resume a normal operating state for semiconductor chip fabrication is disclosed. The bonding apparatus comprises: i) a bonding tool for bonding a wire between a semiconductor chip and a substrate; and ii) a position sensor. Specifically, the method comprises the steps of: a) the position sensor determining a position of the bonding tool when the bonding tool contacts a surface to bond the wire to the substrate; b) the bonding apparatus detecting a bonding failure caused by detachment of the semiconductor from the substrate based on the position of the bonding tool; and c) the bonding apparatus detaching the semiconductor chip from the wire. | ||
| 申请公布号 | US9314869(B2) | 申请公布日期 | 2016.04.19 |
| 申请号 | US201213350363 | 申请日期 | 2012.01.13 |
| 申请人 | ASM Technology Singapore Pte. Ltd. | 发明人 | Lee Wai Wah;Li Jun Feng;Wong Wei Boon;Tan Soo Kin Kenny |
| 分类号 | B23K20/00;H01L23/00 | 主分类号 | B23K20/00 |
| 代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
| 主权项 | 1. A method of recovering a bonding apparatus during a bonding failure to resume a normal operating state for semiconductor chip fabrication, the bonding apparatus having a bonding tool for bonding a wire between a semiconductor chip and a substrate, and a position sensor, the method comprising the steps of: the position sensor determining a position of the bonding tool when the bonding tool contacts a surface to bond the wire to the substrate; the bonding apparatus detecting a bonding failure caused by detachment of the semiconductor chip from the substrate based on the position of the bonding tool; and the bonding apparatus detaching the semiconductor chip from the wire. | ||
| 地址 | Singapore SG | ||