发明名称 High-frequency module
摘要 A high-frequency module includes a multilayer body including stacked dielectric and a pair of ground electrodes spaced apart from each other; a common terminal arranged in the multilayer body to receive and transmit communication signals; and a duplexer that is mounted on a surface of the multilayer body and that separates communication signals input and output via the common terminal. The duplexer includes a first SAW filter mounted on the surface of the multilayer body and grounded by the ground electrode and a second SAW filter mounted on the surface of the multilayer body so as to be spaced apart from the first SAW filter and is grounded by the ground electrode. Thus, degradation of isolation characteristics of the transmission and reception terminals of a splitter is prevented.
申请公布号 US9319026(B2) 申请公布日期 2016.04.19
申请号 US201314094845 申请日期 2013.12.03
申请人 Murata Manufacturing Co., Ltd. 发明人 Uejima Takanori
分类号 H03H9/72;H03H9/05;H04B1/00;H04B1/403 主分类号 H03H9/72
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A high-frequency module comprising a multilayer body including dielectric layers stacked on top of one another and first and second ground conductors that are separated from each other; a common terminal that is provided in the multilayer body and to and from which communication signals are input and output; and a plurality of splitters that are mounted on a surface of the multilayer body and that separate the input and output communication signals via the common terminal; wherein each of the plurality of splitters includes a respective transmission filter that is mounted on the surface of the multilayer body and that is grounded by the first ground conductor and each of the plurality of splitters includes a reception filter that is mounted on the surface of the multilayer body and that is grounded by the second ground conductor.
地址 Kyoto JP