| 发明名称 | Electrode structure | ||
| 摘要 | The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer. | ||
| 申请公布号 | US9320142(B2) | 申请公布日期 | 2016.04.19 |
| 申请号 | US201514598595 | 申请日期 | 2015.01.16 |
| 申请人 | SAMSUNG ELECTRO-MECHANICS CO., LTD. | 发明人 | Baek Seung Min;Kim Yoon Su;Yang Jin Hyuck;Lee Chang Bae |
| 分类号 | H05K1/11;H05K3/40;H05K3/18 | 主分类号 | H05K1/11 |
| 代理机构 | NSIP Law | 代理人 | NSIP Law |
| 主权项 | 1. An electrode structure comprising: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer. | ||
| 地址 | Suwon-si KR | ||