发明名称 | Polishing pad | ||
摘要 | An object of the present invention is to provide a polishing pad having high planarization property and capable of making it possible to suppress the occurrence of scratches. A polishing pad of the present invention has a polishing layer having oval cells each with a long axis inclined by 5° to 45° with respect to the direction of the thickness of the polishing layer. | ||
申请公布号 | US9314898(B2) | 申请公布日期 | 2016.04.19 |
申请号 | US201113636299 | 申请日期 | 2011.03.03 |
申请人 | Toyo Tire & Rubber Co., Ltd. | 发明人 | Kazuno Atsushi |
分类号 | B24D11/00;B24B37/24 | 主分类号 | B24D11/00 |
代理机构 | Morrison & Foerster LLP | 代理人 | Morrison & Foerster LLP |
主权项 | 1. A polishing pad, comprising a polishing layer having oval cells each with a long axis inclined by 30° to 45° with respect to the direction of the thickness of the polishing layer, at least some of the oval cells being closed so as to contain a gas, wherein the oval cells have a ratio (L/S) of average long axis length L to average short axis length S of 1.5 to 3, and the ratio of the number of the oval cells to the number of all cells is at least 80%. | ||
地址 | Osaka-shi JP |