Chip-on-film package and display device having the same

摘要

A chip-on-film package includes a base film, a test line, and an integrated circuit chip. The base film includes a bent area in which a bending occurs. The test line is disposed on the base film, and at least a portion of the test line is overlapped with the bent area. The integrated circuit chip is disposed on the base film and includes a first terminal and a second terminal. The first terminal is connected to one end of the test line to output a first signal and the second terminal is connected to the other end of the test line to receive a second signal. The integrated circuit chip detects whether a crack occurs in the bent area based on a difference value in signal characteristics.

主权项

1. A display device, comprising:
a display panel displaying an image; a printed circuit board driving the display panel; and a chip-on-film package electrically connecting the display panel and the printed circuit board, the chip-on-film package comprising: a base film including a bent area in which bending of the base film occurs; a test line disposed on the base film, at least a portion of the test line overlapping the bent area; and an integrated circuit chip disposed on the base film and including a first terminal connected to one end of the test line to output a first signal and a second terminal connected to the other end of the test line to receive a second signal, the integrated circuit chip determining whether an undesired crack has occurred in the bent area based on a difference in value of signal characteristics between the first signal and the second signal,wherein the integrated circuit chip provides a result signal indicating whether the undesired crack has occurred in the bent area of the printed circuit board, and the printed circuit board receives the result signal and controls a driving condition of the display panel in correspondence with the received result signal.