发明名称 |
Integrated circuit capable of preventing current backflow to power line |
摘要 |
An integrated circuit capable of preventing current backflow to a power line is provided. The integrated circuit includes an input circuit. The input circuit includes a bonding pad and a pull-up circuit, a pull-up switch, a bulk controlled switch and a control circuit. The pull-up switch includes a first control node and a first bulk node. The bulk controlled switch includes a second control node and a second bulk node. The control circuit controls the first and second control nodes according to an internal signal, a power voltage of the power line and a pad voltage of the bonding pad. When the power voltage is a predetermined voltage, the control circuit turns on the bulk controlled switch. When the power line is at a ground voltage and the bonding pad voltage is at the predetermined voltage, the control circuit turns off the bulk controlled switch and the pull-up switch. |
申请公布号 |
US9319046(B2) |
申请公布日期 |
2016.04.19 |
申请号 |
US201514605600 |
申请日期 |
2015.01.26 |
申请人 |
MSTAR SEMICONDUCTOR, INC. |
发明人 |
Kao Shuo-Ting;Yeh Chun-Wen |
分类号 |
H03K19/0175 |
主分类号 |
H03K19/0175 |
代理机构 |
WPAT, PC |
代理人 |
WPAT, PC ;King Justin |
主权项 |
1. An integrated circuit, capable of preventing current backflow to a power line, comprising:
an input circuit, comprising:
a bonding pad, configured to electrically connect to an external signal line;a pull-up switch, comprising a first control node and a first bulk node, configured to electrically connect the bonding pad to the power line;a bulk controlled switch, comprising a second control node and a second bulk node, configured to connect the first bulk node and the second bulk node to the power line; anda control circuit, electrically connected to the power line and the bonding pad, configured to control the first control node and the second control node; wherein, when the power line is at a predetermined voltage, the control circuit turns on the bulk control switch; when the power line is at a ground voltage and the bonding pad is at the predetermined voltage, the control circuit turns off the bulk controlled switch and the pull-up switch. |
地址 |
Hsinchu Hsien TW |