发明名称 Inverter-integrated electric compressor
摘要 A control circuit board (25) configuring an inverter (21) serves as a thermally-conductive substrate. One surface of the control circuit board (25) is installed in a heat transferable manner on a heat-dissipating planar part (31) disposed on a housing (2), while heat-producing electrical components (39) are disposed in a heat transferable manner on the other surface of the control circuit board (25). The control circuit board (25) includes a substrate body (41) constituted of an insulator, and heat-conducting through members (42) constituted of a good thermal conductor filled through in a thickness direction of the substrate body (41). One end of each of the heat-conducting through members (42) is disposed in a heat transferable manner on the heat-dissipating planar part (31), and the electrical component (39) is disposed in a heat transferable manner on the other end.
申请公布号 US9318935(B2) 申请公布日期 2016.04.19
申请号 US201113699905 申请日期 2011.10.20
申请人 MITSUBISHI HEAVY INDUSTRIES, LTD. 发明人 Nakagami Takashi;Nakano Koji;Kamitani Hiroyuki;Takashige Takayuki
分类号 H02K9/22;H02K11/04;F04B39/12;F04B53/08;H02K11/00;H02K5/22;F04C23/00;F04C29/04;F04C18/02 主分类号 H02K9/22
代理机构 Westerman, Hattori, Daniels & Adrian, LLP 代理人 Westerman, Hattori, Daniels & Adrian, LLP
主权项 1. An inverter-integrated electric compressor, comprising an inverter box provided on an outer surface of a housing that contains a compressor for a refrigerant and an electric motor that drives the compressor, an inverter that has a control circuit board and is housed and installed in the inverter box, and a heat-producing electrical component that is loaded on the control circuit board and constitutes the inverter, a heat-dissipating planar part that constitutes an outer wall of the housing being formed inside the inverter box, and heat of the electrical component being cooled by being dissipated to the heat-dissipating planar part side, wherein the control circuit board serves as a thermally-conductive substrate, the thermally-conductive substrate includes a substrate body made of an insulator, and a heat-conducting through member made of a good thermal conductor and filled through in a thickness direction of the substrate body, the heat-conducting through member is located on the thermally-conductive substrate to conform to a loading position of the electrical component, and in the heat-conducting through member, one end surface thereof is disposed in a heat transferable manner on the heat-dissipating planar part, and the electrical component is disposed in a heat transferable manner on the other end surface.
地址 Tokyo JP