发明名称 Thermoelectric module for a thermoelectric generator of a vehicle and vehicle having thermoelectric modules
摘要 A thermoelectric module includes an inner circumferential surface, an axis and an outer circumferential surface. A plurality of semiconductor elements is disposed with thermoelectric material in the direction of the axis and between the inner circumferential surface and the outer circumferential surface and are electrically interconnected in an alternating manner. At least one part of the semiconductor elements has at least one inner frame part or an outer frame part. At least some of the inner frame parts form an interrupted inner circumferential surface or outer frame parts form an interrupted outer circumferential surface.
申请公布号 US9318683(B2) 申请公布日期 2016.04.19
申请号 US201313886425 申请日期 2013.05.03
申请人 EMITEC Gesellschaft fuer Emissionstechnologie mbH;Bayerische Motoren Werke Aktiengesellschaft 发明人 Eder Andreas;Neugebauer Stefan;Linde Matthias;Limbeck Sigrid;Brueck Rolf
分类号 H01L35/28;H01L35/32;F02G5/00 主分类号 H01L35/28
代理机构 代理人 Greenberg Lawrence A.;Stemer Werner H.;Locher Ralph E.
主权项 1. A thermoelectric module, comprising: an inner circumferential surface having an axis; an outer circumferential surface; a plurality of semiconductor elements with thermoelectric material disposed in a direction of said axis between said inner circumferential surface and said outer circumferential surface and said semiconductor elements including at least one p-doped semiconductor element and at least one n-doped semiconductor element electrically interconnected in alternation; at least inner frame parts forming an interrupted inner circumferential surface or outer frame parts forming an interrupted outer circumferential surface; at least one part of said plurality of semiconductor elements having at least one of said inner frame parts or at least one of said outer frame parts; and an inherently unstable casing provided on said interrupted inner circumferential surface or said interrupted outer circumferential surface, said inherently unstable casing forming a circumferential surface directly adjacent heating medium passing the inner circumferential surface of the thermoelectric module or cooling medium passing the outer circumferential surface and protecting said plurality of semiconductor elements from the cooling or heating medium.
地址 Lohmar DE