| 发明名称 | Method for producing a light-emitting diode and light-emitting diode | ||
| 摘要 | A method of producing a light-emitting diode includes providing at least one light-emitting diode chip, providing a suspension comprising a solvent and particles of at least one luminescent material, arranging the at least one light-emitting diode chip in the suspension, electrophoretically depositing the particles on an outer face of the at least one light-emitting diode chip, and completing the light-emitting diode. | ||
| 申请公布号 | US9318667(B2) | 申请公布日期 | 2016.04.19 |
| 申请号 | US201214240481 | 申请日期 | 2012.07.16 |
| 申请人 | OSRAM Opto Semiconductors GmbH | 发明人 | Stoll Ion;Gallmeier Hans-Christoph;Petersen Kirstin |
| 分类号 | H01L33/00;H01L21/30;H01L33/50 | 主分类号 | H01L33/00 |
| 代理机构 | DLA Piper LLP (US) | 代理人 | DLA Piper LLP (US) |
| 主权项 | 1. A method of producing a light-emitting diode comprising: providing at least one light-emitting diode chip, applying an electrically conductive protective material to parts of an outer face of each light-emitting diode chip, providing a suspension comprising a solvent and particles of at least one luminescent material, arranging the at least one light-emitting diode chip in the suspension, electrophoretically depositing the particles on an outer face of the at least one light-emitting diode chip, fixing the particles on the outer face after depositing the particles, removing the particles in places from the outer face after fixing the particles, removing the electrically conductive protective material after the electrophoretic deposition, and completing the light-emitting diode. | ||
| 地址 | DE | ||