Semiconductor packages and methods of forming the same

摘要

Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a semiconductor package including a first package including one or more dies, and a redistribution layer coupled to the one or more dies at a first side of the first package with a first set of bonding joints. The redistribution layer including more than one metal layer disposed in more than one passivation layer, the first set of bonding joints being directly coupled to at least one of the one or more metal layers, and a first set of connectors coupled to a second side of the redistribution layer, the second side being opposite the first side.

主权项

1. A semiconductor package comprising:
a first package comprising one or more dies; and a redistribution layer coupled to the one or more dies at a first side of the first package with first bonding joints, the redistribution layer comprising more than one metal layers disposed in more than one passivation layers, each of the first bonding joints comprising a first conductive layer extending from the first side of the first package, a second conductive layer directly coupled to at least one of the more than one metal layers, and a joining material disposed between the first conductive layer and the second conductive layer, the joining material having a different material composition from each of the first conductive layer and the second conductive layer; and a first set of connectors coupled to a second side of the redistribution layer, the second side being opposite the first side.