| 主权项 |
1. A semiconductor device comprising:
an upper chip and a lower chip, which are arranged to partially overlap with each other in a plan view; and a supporting base which is provided adjacent to at least a portion of an outer periphery of the lower chip in a plane direction of the lower chip and supports the upper chip, wherein the lower chip includes, on a surface thereof facing the upper chip, a first group of connection terminals arranged on a straight region that includes a corner region of the lower chip and a region extending from the corner region along one side of the lower chip, the upper chip includes, on a surface thereof facing the lower chip, a second group of connection terminals, the upper chip and the lower chip are arranged so that the first group of connection terminals at least partially overlaps with the second group of connection terminals, the first group of connection terminals is at least partially electrically connected to the second group of connection terminals, and the supporting base is a resin expansion portion which is continuous with the outer periphery of the lower chip and made of a resin material, wherein the resin expansion portion is arranged in a range covering an outer periphery of the upper chip, and the semiconductor device further includes:
an extension IO pad arranged on the resin expansion portion outside of the outer periphery of the upper chip, anda wire to electrically connect the extension IO pad to an IO cell that is arranged in a peripheral region of the lower chip, the peripheral region forming part of a region where the upper chip overlaps with the lower chip and excluding the straight region. |
