Storage device backplane with penetrating convection and computer framework

摘要

A storage device backplane with penetrating convection and a computer framework with the storage device backplane are disclosed. The storage device backplane includes an integration board, an operation board and a heat dissipation unit. The integration board has a first surface for electrically connecting the storage device group. The operation board is superposed on and electrically connected to a second surface of the integration board and is provided that the operation board includes an electronic heating active element (EHAE) and an airflow hole set around the EHAE. The heat dissipation unit includes a heat absorb portion and multiple fins set on the heat absorb portion. The heat absorb portion makes a thermal contact with the EHAE. The fins laterally extend to cover the airflow hole. Airflow passages are formed between the fins corresponding to the airflow hole.

主权项

1. A storage device backplane for electrically connecting between a motherboard and a storage device group of a server, comprising:
an integration board, having a first surface for electrically connecting the storage device group; an operation board, superposed on and electrically connected to a second surface of the integration board, provided that the operation board comprises an electronic heating active element (EHAE) and an airflow hole set around the EHAE; and a heat dissipation unit, comprising a heat absorb portion and multiple fins set on the heat absorb portion, wherein the heat absorb portion makes a thermal contact with the EHAE, the fins laterally extend to cover the airflow hole, and airflow passages formed between the fins corresponding to the airflow hole, wherein the integration board comprises a plurality of vents set corresponding to the airflow hole and the airflow passages.