发明名称 Vapor deposition device
摘要 A vapor deposition device has a plurality of moving plates between the cooling plate and moving vapor deposition source is controlled by the blowout panel. Moreover, when the vapor deposition materials absorbed by the blowout panel are up to the predetermined value, the moving plates are rotated around their axis simultaneously by the linkage to form a new blowout panel for performing the subsequent vapor deposition process. Consequently, the adsorption ability of the blowout board is greatly improved, and the crack and peeling off of the blowout panel caused by absorbing too many vapor deposition materials are avoided. Hence, the volume production of the evaporative coating equipment is improved.
申请公布号 US9315893(B2) 申请公布日期 2016.04.19
申请号 US201414280289 申请日期 2014.05.16
申请人 EVERDISPLAY OPTRONICS (SHANGHAI) LIMITED 发明人 Huang ChunYun
分类号 C23C16/00;C23C14/56;H01L51/00 主分类号 C23C16/00
代理机构 Lackenbach Siegel, LLP 代理人 Young, Esq. Andrew F.;Lackenbach Siegel, LLP
主权项 1. A vapor deposition device having a moving vapor deposition source for coating on a substrate, the vapor deposition device comprising: the moving vapor deposition source is movable in a first direction; a cooling plate adapted to be securely installed over the moving vapor deposition source; the substrate placed at an opening of the cooling plate; and a plurality of moving plates arranged in the first direction rotatably installed between the cooling plate and the vapor deposition source by a fixing device except in front of the opening of the cooling plate; wherein, the moving plates rotate around the fixing device simultaneously, which forms blowout panels.
地址 Shanghai CN