| 摘要 |
The present invention relates to a polyamide molding composition which comprises: (A) 29-89 wt% of at least partially crystallized thermoplastic homo- or co-polyamide; (B) 1-15 wt% of ethylene-vinyl acetate copolymer; (C) 10-70 wt% of a filling and reinforcing agent selected from a fibrous reinforcing material, a particle filler, and a mixture thereof; (D) 0-20 wt% of an impact reinforcing agent excluding (B) and/or a polymer excluding (A); (E) 0-20 wt% of a flame retardant; and (F) 0-5 wt% of an additive, wherein the sum of (A)-(F) is 100 wt%. In terms of (A), the polyamide has the melting enthalpy (ΔHm) ranging from 30 to 70 J/g and the melting point (Tm) of at least 270°C, measured by the ISO standard 11357-3 under a condition satisfying the heating speed of 20°C/min respectively in a granular state. In addition, the polyamide is selected from the group composed of an aliphatic polyamide, an alicyclic polyamide, a partially aromatic polyamide, or a mixture thereof. |
