The present invention relates to a method for manufacturing a light emitting diode package including a phosphor. According to the present invention, the method for manufacturing a light emitting diode package comprises the following steps: preparing a phosphor; processing the phosphor with heat; mounting a light emitting diode chip in a main body to be electrically connected to the outside; and forming a wavelength conversion unit including the phosphor processed with heat on the light emitting diode chip. The heating process is performed within the temperature of 250 to 350°C.
