| 摘要 |
Provided is a dry film which offers a cured product with excellent heat resistance, low bendability, and crack resistance, and exhibits superior peeling properties with a carrier film while preventing cracking and powder leakage. Also provided is a printed circuit board which comprises a cured product obtained by curing the dry film. According to the present invention, the dry film comprises a thermosetting resin component, at least one of a hardening agent and hardening accelerator, maleimide compound, a filler, and a resin layer containing at least two different solvents. The boiling point of the two solvents is greater than or equal to 100 °C with difference for more than 5 °C. |
