发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 The present invention relates to a light emitting diode package including a phosphor with narrow full width at half maximum (FWHM). The light emitting diode package according to present invention includes: a housing; a light emitting diode chip disposed in the housing; an encapsulation part covering the light emitting diode chip; a first phosphor distributed in the encapsulation part, for emitting green light; and a second phosphor and a third phosphor distributed in the encapsulation part, for emitting red light, wherein the second phosphor is a phosphor with a chemical formula of A_2MF_6: Mn^4+. Wherein, A is one of Li, Na, K, Rb, Ce, and NH_4, M is one of Si, Ti, Nb, and Ta. The third phosphor has a mass range between 0.1wt% and 1wt% with respect to the encapsulation part.
申请公布号 KR20160041469(A) 申请公布日期 2016.04.18
申请号 KR20140135337 申请日期 2014.10.07
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 OH, KWANG YONG;KANG, MIN KYUNG;NAM, KI BUM
分类号 H01L33/50 主分类号 H01L33/50
代理机构 代理人
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