| 摘要 |
One purpose of the present invention is to provide a sputtering target stably maintained in a substrate, by preventing a crack of a sputtering target material. Provided is the sputtering target, comprising: a substrate formed of a metal; a sputtering target material formed on one surface of the substrate; and an adhesion material formed between the substrate and the sputtering target material. The adhesion material includes at least a first metal element and a second metal element. The second metal element at concentrations greater than or equal to 10 ppm and less than or equal to 5000 ppm with respect to the first metal element, is included in the adhesion material. |
