PACKAGED SEMICONDUCTOR DEVICES AND PACKAGING METHODS THEREOF

摘要

Disclosed are a packaged semiconductor device and a packing method thereof. According to some embodiments of the present invention, a packaged semiconductor device comprises a first device and a second device coupled to the first device. The second device includes an integrated circuit die covered by a molding compound. An over-mold structure is disposed over the second device. According to the present invention, the over-mold structure prevents an edge of the packaged semiconductor device from being chipped, during singulation, shipping, and a transporting process.