| 摘要 |
Provided is a semiconductor light emitting device. The semiconductor light emitting device according to an embodiment of the present invention includes: a package body having the first and second surfaces which are opposed to each other, and a plurality of side surfaces disposed therebetween; first and second external terminal blocks which are disposed in both end portions of the package body, respectively, and each of which has a portion exposed to the surfaces of the package body; a wavelength converting material layer disposed between the first and second external terminal blocks, and having a first surface substantially coplanar with the first surface of the package body, and a second surface opposite to the first surface of the wavelength converting material layer; and a light emitting diode (LED) chip disposed between the first and second external terminal blocks within the package body, disposed on at least a portion of the second surface of the wavelength converting material layer, and electrically connected to the first and second external terminal blocks. |
