发明名称 METHOD AND DEVICE FOR JOINING TWO MATERIAL LAYERS BY MEANS OF HIGH-FREQUENCY WELDING
摘要 The invention relates to a method for joining two material layers (10, 20) by means of high-frequency welding. In said method, the two material layers (10, 20) are placed on top of each other to form a material arrangement such that the end-face ends (11, 21) thereof have a pre-determined lateral distance (30) to one another. The material arrangement is introduced into a joining device (40) such that the region of the end-face ends (11, 21) of the arrangement comes to rest between a first welding electrode (41) and a second welding electrode (42) of the joining device (40). The end-face end (11) of the first material layer (10) comes to rest between the respective opposite front surfaces (43, 44) of the first and second welding electrode (41, 42). The end-face end (21) of the second material layer (20) comes to rest outside of the respective opposite front surfaces (43, 44) of the first and second welding electrode (41, 42). The joining process is then carried out, as a result of which a stepped profile of the connection of the material layers (10, 20) is obtained in cross-section.
申请公布号 WO2016055471(A1) 申请公布日期 2016.04.14
申请号 WO2015EP73039 申请日期 2015.10.06
申请人 CONTI TEMIC MICROELECTRONIC GMBH 发明人 FOISTNER, ANDREAS;PROSSLINER, WERNER
分类号 B29C65/04;B29K27/06;B29K75/00;B29K77/00;B29L31/58 主分类号 B29C65/04
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