THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE USING THROUGH ELECTRODE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a through electrode substrate that eliminates a problem due to gas accumulated in a gas reservoir in a through hole and can prevent a filler in the through hole from falling off.SOLUTION: A through electrode substrate of the present invention includes: a substrate having a through hole that penetrates a first opening on a first surface and a second opening on a second surface; and a filler arranged in the through hole. The second opening is larger than the first opening, and a minimum opening part having the smallest area in a plain view exists between the first opening and the second opening. The through electrode substrate also includes a gas emission part that is arranged so as to contact the filler being exposed to either the first surface or the second surface.SELECTED DRAWING: Figure 1