| 摘要 |
PROBLEM TO BE SOLVED: To join an electrode of a circuit board and a metal terminal of an electronic component with ultrasonic wave.SOLUTION: A space part with a through hole filled with a metal member 4 is provided right below an electrode 5 of a circuit board 20, the lower end surface of the metal member 4 is exposed to the lower side of the circuit board 20, a lead terminal 10 is placed on the electrode 5, the lower end surface of the metal member 4 is pressed upward with an anvil 30, and the surface of the lead terminal 10 is pressed downward with an ultrasonic horn 15 to apply proper pressure to the junction interface between the lead terminal 10 and the electrode 5. If an ultrasonic joining head 1 is driven in this state, since the electrode 5 is stably fixed with the anvil 30 via the metal member 4, the amplitude loss is suppressed and the junction interface between the lead terminal 10 and the electrode 5 is joined with ultrasonic wave due to melting and bonding.SELECTED DRAWING: Figure 1 |
