发明名称 |
METHOD FOR PRODUCING PLATED ARTICLE |
摘要 |
There is provided a method for producing a plated article, comprising immersing a substrate made of a conductive metal in a plating solution and forming a plating layer on the substrate by electroplating, wherein the plating solution is a solution containing 0.01 to 1 mol/L of Ni ions with pH of 6 or more; and a porous Ni plating layer is formed by performing the electroplating at a cathode current density of 10 A/dm2 or more. This method allows for easily producing a plated article wherein a uniform porous Ni plating layer is formed on the surface of a substrate. |
申请公布号 |
US2016102412(A1) |
申请公布日期 |
2016.04.14 |
申请号 |
US201414894068 |
申请日期 |
2014.10.24 |
申请人 |
OM SANGYO CO., LTD. |
发明人 |
TAKAMIZAWA Masao;NISHIMURA Yoshiyuki;FUKUDA Chisa |
分类号 |
C25D3/12;C25D21/12 |
主分类号 |
C25D3/12 |
代理机构 |
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代理人 |
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主权项 |
1. A method for producing a plated article, comprising
immersing a substrate made of a conductive metal in a plating solution, and forming a plating layer on the substrate by electroplating, wherein the plating solution is a solution containing 0.01 to 1 mol/L of Ni ions with a pH of 6 or more; and a porous Ni plating layer is formed by performing the electroplating at a cathode current density of 10 A/dm2 or more. |
地址 |
Okayama-shi, Okayama JP |