Au-Sn SOLDER ALLOY HAVING CONTROLLED METALLOGRAPHIC STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an Au-Sn-based solder alloy which has excellent wettability and where a solder volume substantially contributing to solder joint at solder jointing can be almost maintained.SOLUTION: An Au-Sn-based solder alloy includes 18.5 mass% or more and 23.5 mass% or less of Sn, preferably 19.0 mass% or more and 22.8 mass% or less and the balance Au except elements inevitably included in production and 80% or more of the cross sectional area of the solder alloy is occupied by a metallographic structure consisting of a striped lamellar structure and/or a circular or elliptical lamellar structure.SELECTED DRAWING: None