| 主权项 |
1. An electronic package adapted for connection to a rear frame member of an electric machine of liquid-cooled and/or air-cooled type, the electronic package comprising:
a cooling tower having opposite first and second axial ends spaced along a package central axis, the cooling tower comprising a metallic wall extending about the package central axis to define a radially outer wall surface, wherein the cooling tower is at ground potential and defines a heat sink; and a plurality of power modules mounted in conductive thermal communication to the cooling tower at circumferentially distributed positions on the radially outer wall surface, each power module comprising:
a thermally and electrically conductive base having opposite first and second surfaces, the first surface adapted for mounting the power module in conductive thermal communication with a heat sink at ground potential, anda pair of positive and negative MOSFET devices superposing the base second surface, wherein the MOSFET devices of the pair are both in conductive thermal communication with the base, andwherein transference from the power module of heat generated by the MOSFET devices occurs along a primary cooling path from the power module to the heat sink through the base; wherein heat transference to the cooling tower from each power module occurs along the respective primary cooling path, and wherein transference along the primary cooling paths of heat from the cooling tower includes thermal convection to air and/or liquid. |
