Power Converter Package with Integrated Output Inductor

摘要

In one implementation, a semiconductor package includes a first patterned conductive carrier including partially etched segments. The semiconductor package also includes a control FET having a control drain attached to a first partially etched segment of the first patterned conductive carrier. In addition, the semiconductor package includes a sync FET having a sync source and a sync gate attached to respective second and third partially etched segments of the first patterned conductive carrier. The semiconductor package further includes a second patterned conductive carrier having a switch node segment situated over a control source of the control FET and over a sync drain of the sync FET, as well as an inductor coupled between the switch node segment and an output segment of the second patterned conductive carrier.

主权项

1. A semiconductor package comprising:
a first patterned conductive carrier; a control FET having a control drain attached to a first partially etched segment of said first patterned conductive carrier; a sync FET having a sync source and a sync gate attached to respective second and third partially etched segments of said first patterned conductive carrier; a second patterned conductive carrier having a switch node segment situated over a control source of said control FET and over a sync drain of said sync FET; an inductor coupled between said switch node segment and an output segment of said second patterned conductive carrier.