PEDESTAL SURFACE FOR MOSFET MODULE

摘要

An electronic package connectable to an electric machine includes a cooling tower having a metallic wall with a radially outer wall surface. The radially outer wall surface includes discrete, radially outwardly projecting pedestals. The planar pedestal mounting surfaces are parallel with the central axis such that the radial distance between the axis and the radially outer wall surface is greater within the periphery than outside the periphery. Power modules are mounted to the pedestals. Each power module includes a base in thermal contact with a pedestal mounting surface and an opposing interior surface in thermal communication with a MOSFET power electronics device. A cover plate is spaced from the base interior surface. A dielectric housing member surrounds the MOSFET power electronics devices. An electrical connection terminal is disposed outside the periphery of each module. An electric machine including such an electronic package is also disclosed.

主权项

1. An electronic package adapted for connection to a rear frame member of an electric machine, the electronic package comprising:
a cooling tower comprising a metallic wall extending about a cooling tower central axis to define a radially outer wall surface, the radially outer wall surface provided with a plurality of discrete, radially outwardly projecting pedestals at circumferentially distributed locations about the cooling tower central axis, each pedestal defining the periphery of a planar mounting surface, the respective mounting surface of each pedestal parallel with the cooling tower central axis, wherein the radial distance between the cooling tower central axis and the radially outer wall surface is greater within the periphery of each pedestal mounting surface than outside the periphery of the respective pedestal mounting surface; and a plurality of power modules mounted to the pedestal mounting surfaces, each power module comprising:
a planar metallic base defining a module mounting surface and an opposing base interior surface, the module mounting surface and the respective pedestal mounting surface in mutual surface-to-surface contact, whereby the power module base and the cooling tower are in conductive thermal communication with each other,MOSFET power electronics devices attached to and in conductive thermal communication with the base interior surface;a metallic cover plate in spaced superposition relative to the base interior surface and electrically isolated from the MOSFET power devices,a dielectric housing member defining a module housing wall surrounding the MOSFET power electronics devices and disposed between the base and the cover plate, andan electrical connection terminal communicating with the power electronics devices and disposed outside the periphery of the base module mounting surface.