Method for Manufacturing a Surface Mount Device

摘要

A method of manufacturing a surface mount device includes forming a plaque from a material, forming a plurality of conductive protrusions on a top surface and a bottom surface of the plaque, and applying a liquid encapsulant over at least a portion of the top surface and at least a portion of the bottom surface of the plaque. The liquid encapsulant is cured and when cured encapsulant has an oxygen permeability of less than about 0.4 cm3·mm/m2·atm·day. The assembly is cut to provide a plurality of components. After cutting, the top surface of each component includes at least one conductive protrusion, the bottom surface of each component includes at least one conductive protrusion, the top surface and the bottom surface of each component include the cured encapsulant, and a core of each component includes the material.

主权项

1. A method of manufacturing a surface mount device, the method comprising:
forming a plaque from a material; forming a plurality of conductive protrusions on a top surface and a bottom surface of the plaque; applying a liquid encapsulant over at least a portion of the top surface and at least a portion of the bottom surface of the plaque; curing the liquid encapsulant, wherein the cured encapsulant has an oxygen permeability of less than about 0.4 cm3·mm/m2·atm·day; and cutting through the cured encapsulant and plaque to provide a plurality of components, wherein after cutting, the top surface of each component includes at least one conductive protrusion, the bottom surface of each component includes at least one conductive protrusion, the top surface and the bottom surface of each component include the cured encapsulant, and a core of each component includes the material.