| 摘要 |
The present invention provides a semiconductor package. The semiconductor package comprises: a package substrate having a cavity formed therein; a plurality of semiconductor chips which are located and vertically stacked in the cavity; a first insulating layer which is located on a first surface of the package substrate, and includes a first wiring layer; and a second insulating layer which is located on a second surface facing the first surface, and includes a second wiring layer. Therefore, the semiconductor package embeds the vertically stacked semiconductor chips in the package substrate. |
