| 摘要 |
PROBLEM TO BE SOLVED: To provide a chemical planarization method and a chemical planarization device capable of efficiently planarizing while preventing from damaging a surface to be processed.SOLUTION: The chemical planarization method includes the steps of: forming a hydrophobic protection film over a film to be processed which has an irregularity on the surface along an irregularity; supplying a solving liquid for solving the film to be processed over the surface of the protection film; selectively removing a part of the protection film from the film to be processed by means of hydrophobic interaction by bringing the protection film into contact with or closer to a processing body which has a hydrophobic surface; and solving the film to be processed from which the part of the protection film is removed using a solving liquid.SELECTED DRAWING: Figure 1 |
