| 发明名称 |
AUTOMATIC HEIGHT COMPENSATING AND CO-PLANAR LEVELING HEAT REMOVAL ASSEMBLY FOR MULTI-CHIP PACKAGES |
| 摘要 |
Embodiments of the present disclosure may include a heat removal assembly that is to thermally couple with two or more dice of an electronic device. The heat removal assembly may include a bellows to automatically adjust a position of at least one surface of the heat removal assembly relative to another surface of the heat removal assembly. Other embodiments may be described and/or claimed. |
| 申请公布号 |
US2016106003(A1) |
申请公布日期 |
2016.04.14 |
| 申请号 |
US201514861892 |
申请日期 |
2015.09.22 |
| 申请人 |
Intel Corporation |
发明人 |
Bosak Henry C.;Boyd Thomas A.;Kofstad Harvey R. |
| 分类号 |
H05K7/20;H05K1/02 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A heat removal assembly comprising:
two or more surfaces to thermally couple with respective surfaces of two or more dies; and bellows to automatically adjust a position of at least one surface of the two or more surfaces relative to another surface of the two or more surfaces. |
| 地址 |
Santa Clara CA US |
